JPH064295Y2 - 温度センサ - Google Patents
温度センサInfo
- Publication number
- JPH064295Y2 JPH064295Y2 JP2536387U JP2536387U JPH064295Y2 JP H064295 Y2 JPH064295 Y2 JP H064295Y2 JP 2536387 U JP2536387 U JP 2536387U JP 2536387 U JP2536387 U JP 2536387U JP H064295 Y2 JPH064295 Y2 JP H064295Y2
- Authority
- JP
- Japan
- Prior art keywords
- temperature sensor
- molding material
- holding pieces
- terminal
- wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000012778 molding material Substances 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims 2
- 238000005452 bending Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 5
- 238000001514 detection method Methods 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 230000004043 responsiveness Effects 0.000 description 3
- 238000007710 freezing Methods 0.000 description 2
- 230000008014 freezing Effects 0.000 description 2
- 230000003685 thermal hair damage Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000008642 heat stress Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2536387U JPH064295Y2 (ja) | 1987-02-23 | 1987-02-23 | 温度センサ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2536387U JPH064295Y2 (ja) | 1987-02-23 | 1987-02-23 | 温度センサ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63132330U JPS63132330U (en]) | 1988-08-30 |
| JPH064295Y2 true JPH064295Y2 (ja) | 1994-02-02 |
Family
ID=30825449
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2536387U Expired - Lifetime JPH064295Y2 (ja) | 1987-02-23 | 1987-02-23 | 温度センサ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH064295Y2 (en]) |
-
1987
- 1987-02-23 JP JP2536387U patent/JPH064295Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63132330U (en]) | 1988-08-30 |
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